William (Bill) Binder

bbinder's picture

William (Bill) Binder is currently a postdoctoral research assistant in Mechanical Engineering. 

Contact Information

Manufacturing Research Center (MaRC)
Georgia Institute of Technology
813 Ferst Drive NW
Atlanta, Georgia 30332-0405

Room: MaRC 264
Tel.: +1 (404) 894-8170
E-Mail: binderw(at)gatech.edu

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Research Interests

My research interests include risk management and decision-making for the design of flexible, resilient, and complex systems.


Publications

Submitted
2017
Lee, B., K. B. Fillingim, W. R. Binder, K. Fu, and C. J. J. Paredis, "Design Heuristics: A Conceptual Framework and Preliminary Method for Extraction", Proceedings of the ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference, 2017.
Binder, W. R., and C. J. J. Paredis, "Optimization Under Uncertainty Versus Algebraic Heuristics: A Research Method for Comparing Computational Design Methods", Proceedings of the ASME 2017 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, 2017.
2016
2014
Newnes, L. B., Y. M. Goh, B. D. Lee, W. R. Binder, and C. J. J. Paredis, "Price to win through value modelling for service offering", The 3rd International Business Servitization Conference, Bilbao, Spain, Orkestra-Basque Institute of Competitiveness and Deusto Business School, 11/2014.
Lee, B. D., W. R. Binder, and C. J. J. Paredis, "A Systematic Method for Specifying Effective Value Models", 2014 Conference on Systems Engineering Research, vol. 28, Redondo Beach, CA, Procedia Computer Science, pp. 228-236, 03/2014.
Binder, W. R., C. J. J. Paredis, and H. E. Garcia, "Hybrid Energy System Modeling in Modelica", 10th International Modelica Conference, Lund, Sweden, 2014.
Du, W., H. E. Garcia, W. R. Binder, and C. J. J. Paredis, "Value-driven design and sensitivity analysis of hybrid energy systems using surrogate modeling", Renewable Energy Research and Application (ICRERA), 2014 International Conference on: IEEE, pp. 395–400, 2014.